International Journal of Advanced Multidisciplinary Application (IJAMA)

Peer reviewed Journal II Open access Journal II ISSN Approved No: 3048-9350

Author :Senthil Kumar¹, Ms. P. Lakshmi², . R. Dinesh³, A. Kavitha⁴, Mr. S. Manikandan⁵

Affiliation:1,2,3,4,5Department of Electrical and Electronics Engineering, Karpagam Institute of Technology, Coimbatore, India

Volume/Issue : Volume 2 Issue 9 -2025/Sep ,Pages : 9 to 13

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Abstract

Wide bandgap (WBG) semiconductors such as silicon carbide (SiC) and gallium nitride (GaN) are revolutionizing modern power electronics by enabling higher efficiency, compact design, and superior thermal performance compared to traditional silicon-based devices. These materials provide wide energy bandgaps, higher breakdown voltages, faster switching speeds, and improved thermal conductivity, making them ideal for applications in electric vehicles, renewable energy systems, and high-frequency converters. This paper provides an overview of the fundamental properties of WBG semiconductors, their advantages in power electronics, and the challenges associated with material quality, fabrication cost, and reliability. It also explores emerging trends and research directions that will define the next generation of high-performance power devices.

Keywords: Wide Bandgap Semiconductors, Silicon Carbide, Gallium Nitride, Power Electronics, High-Efficiency Devices, Renewable Energy Systems, Electric Vehicles

References

[1] B. J. Baliga, Fundamentals of Power Semiconductor Devices, 2nd ed., Springer, 2010.

[2] J. Millán, P. Godignon, X. Perpiñà, A. Pérez-Tomás, and J. Rebollo, “A survey of wide bandgap power semiconductor devices,” IEEE Trans. Power Electron., vol. 29, no. 5, pp. 2155–2163, May 2014.

[3] M. Rashid, Power Electronics Handbook, 4th ed., Academic Press, 2018.

[4] R. R. King et al., “Silicon carbide MOSFETs for high-voltage power electronics applications,” in Proc. IEEE Energy Conversion Congress and Exposition (ECCE), 2017, pp. 232–239.

[5] U. K. Mishra, P. Parikh, and Y. Wu, “AlGaN/GaN HEMTs—An overview of device operation and applications,” Proc. IEEE, vol. 90, no. 6, pp. 1022–1031, Jun. 2002.

[6] D. J. Meyer et al., “High-efficiency GaN power devices and converters,” IEEE Trans. Power Electron., vol. 32, no. 7, pp. 5260–5273, Jul. 2017.

[7] H. Okumura et al., “Reliability and failure mechanisms of SiC MOSFETs for industrial applications,” IEEE Trans. Device Mater. Rel., vol. 18, no. 1, pp. 1–9, Mar. 2018.

[8] Y. Chen, X. Zhu, and W. Zhao, “Application of SiC devices in electric vehicle inverters,” IEEE Trans. Veh. Technol., vol. 68, no. 6, pp. 5167–5175, Jun. 2019.

[9] J. Biela, R. W. De Doncker, and M. Schweizer, “High-efficiency power converters with wide-bandgap semiconductors,” IEEE Ind. Electron. Mag., vol. 6, no. 2, pp. 40–51, Jun. 2012.

[10] F. Udrea, A. Qamar, and R. J. Trew, “GaN power devices for high-frequency converters,” IEEE Trans. Electron Devices, vol. 55, no. 8, pp. 1992–2000, Aug. 2008.

[11] M. Lauro, P. Friedrichs, and T. Knöchel, “Thermal performance of SiC power modules in renewable energy applications,” IEEE Trans. Ind. Appl., vol. 55, no. 4, pp. 3941–3949, Jul.–Aug. 2019.

[12] W. Zhang, S. Fang, and H. Yu, “High-frequency GaN power converters for compact systems,” IEEE Trans. Power Electron., vol. 34, no. 12, pp. 11775–11787, Dec. 2019.

[13] S. Agarwal and R. Baliga, “Device design considerations for high-voltage SiC MOSFETs,” IEEE Electron Device Lett., vol. 31, no. 7, pp. 724–726, Jul. 2010.

[14] H. K. Cho et al., “GaN devices for automotive and industrial applications,” IEEE Trans. Ind. Electron., vol. 66, no. 10, pp. 7924–7935, Oct. 2019.

[15] S. B. Bayne, J. Lutz, and R. Burgos, “Wide-bandgap semiconductors: Opportunities and challenges for power electronics,” IEEE Ind. Electron. Mag., vol. 12, no. 3, pp. 6–17, Sep. 2018.

[16] M. S. Shur, GaN-Based Materials and Devices, World Scientific, 2016.

[17] R. W. Erickson and D. Maksimovic, Fundamentals of Power Electronics, 2nd ed., Springer, 2001.

[18] J. A. Cooper and B. J. Baliga, “The future of wide bandgap power devices,” IEEE Trans. Electron Devices, vol. 64, no. 3, pp. 905–911, Mar. 2017.

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